A 50mhz Multichip Processor Module With Flip Chip Technology

A 50 MHz processor multichip module, comprised of OEM die bumped for flip chip interconnect, was designed and fabricated for Sun Microsystems, Inc. by IBM Microelectronics. The MCM was implemented in a 44mm x 64mm MCM-C package with a pin grid array (PGA) module attachment to a card designed and fab...

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Bibliographic Details
Main Authors: Miller, B., Volkringer, N., Lo-Soun Su, Yee Ming Ting, Mike Loo, Kumar, R., Smith, B.
Format: Conference Proceeding
Language:English
Subjects:
Electronic packaging thermal management
Electronics packaging
Flip chip
Foundries
Integrated circuit interconnections
Microelectronics
Multichip modules
Signal design
Sun
Testing
Online Access:Request full text
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Summary:A 50 MHz processor multichip module, comprised of OEM die bumped for flip chip interconnect, was designed and fabricated for Sun Microsystems, Inc. by IBM Microelectronics. The MCM was implemented in a 44mm x 64mm MCM-C package with a pin grid array (PGA) module attachment to a card designed and fabricated by Sun Microsystems, Inc.. The MCM design was accepted from Sun Microsystems, Inc. via a completed logic design into the IBM Packaging Foundry using Cadence Allegro 7.0. Application achievements include bumping die on an OEM wafer after signal redistribution for flip chip interconnect and the release of an MCM design into the IBM Foundry using Cadence Allegro 7.0 design system. The functional performance testing will be provided by Sun Microsystems, Inc.. This paper discusses all aspects of the MCM development including physical and electrical design, rapid prototype build, thermal management, module assembly, module interconnect test and module functional performance.
DOI:10.1109/ICMCM.1994.753610