Electrical-Thermal Co-Simulation for Analysis of High-Power RF/Microwave Components

An electrical-thermal co-simulation based on the finite element method is presented for analysis of high-power RF/microwave circuits. The co-simulation integrates a full-wave electromagnetic analysis and a transient thermal analysis through an iterative scheme, and is devised for the design and anal...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2017-02, Vol.59 (1), p.93-102
Main Authors: Lu, Tianjian, Jin, Jian-Ming
Format: Article
Language:English
Subjects:
Algorithms
Amplifiers
Conductivity
Design analysis
Domain decomposition
electrical-thermal co-simulation
Finite element analysis
Finite element method
finite element method (FEM)
Mathematical analysis
Mathematical model
Microwave circuits
Permittivity
Radio frequency
Stability analysis
substrate integrated waveguide (SIW)
temperature stability
Thermal analysis
Transient analysis
Waveguide filters
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Summary:An electrical-thermal co-simulation based on the finite element method is presented for analysis of high-power RF/microwave circuits. The co-simulation integrates a full-wave electromagnetic analysis and a transient thermal analysis through an iterative scheme, and is devised for the design and analysis of RF/microwave circuits operated at high frequencies and high power levels. To enhance the efficiency in solving large-scale problems, a domain decomposition scheme called the finite element tearing and interconnecting and an adaptive time-stepping scheme based on the algorithm of proportional-integral-derivative control are incorporated into the co-simulation. Temperature stability analysis is performed with the proposed co-simulation for a matching network in high-power RF amplifiers and for a substrate integrated waveguide filter.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2016.2597311