High-throughput sample preparation method for Cu pillar FCQFN

We present a fast and high-throughput sample preparation method for FA (failure analysis) of Cu pillar FCQFN package. Our method facilitates simultaneous decapsulation of multiple devices, and with reduced number of package decapsulation steps. Further, throughput-time (TPT) for sample preparation i...

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Bibliographic Details
Main Authors: Ke-Ying Lin, Wenjing Wang, Sharon Chen
Format: Conference Proceeding
Language:English
Subjects:
Decision support systems
Failure analysis
Integrated circuits
Online Access:Request full text
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Description
Summary:We present a fast and high-throughput sample preparation method for FA (failure analysis) of Cu pillar FCQFN package. Our method facilitates simultaneous decapsulation of multiple devices, and with reduced number of package decapsulation steps. Further, throughput-time (TPT) for sample preparation is reduced from 90 min to 30 min.
ISSN:1946-1550
DOI:10.1109/IPFA.2016.7564261