Case study of leakage/short on PCB after biased-HAST

After HAST of WLCSP devices mounted on PCB, several short and leakage failures were observed. Non-destructive technique, lock-in thermography (LIT) was applied to localize the fault on PCB. Thereafter, physical failure analysis (PFA) was performed. It revealed solder contamination between the solder...

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Bibliographic Details
Main Authors: Ke-Ying Lin, Chen, Sharon
Format: Conference Proceeding
Language:English
Subjects:
Decision support systems
Failure analysis
Integrated circuits
Online Access:Request full text
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Summary:After HAST of WLCSP devices mounted on PCB, several short and leakage failures were observed. Non-destructive technique, lock-in thermography (LIT) was applied to localize the fault on PCB. Thereafter, physical failure analysis (PFA) was performed. It revealed solder contamination between the solder bumps of PCB as cause of the failures.
ISSN:1946-1550
DOI:10.1109/IPFA.2016.7564262