FMI applied to the study of the temperature distribution in flip chips

The use of fluorescent microthermal imaging (FMI) as a tool to study the temperature distribution in flip chip packages was investigated. Backgrinding of the die was required to minimize heat diffusion and maximize the spatial resolution. A test structure was created in order to evaluate FMI spatial...

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Bibliographic Details
Main Authors: Boyer, N., Masson, D.P., Meunier, M., Simard-Normandin, M.
Format: Conference Proceeding
Language:English
Subjects:
Copper
Failure analysis
Flip chip
Fluorescence
Heat sinks
Integrated circuit packaging
Integrated circuit technology
Packaging machines
Spatial resolution
Temperature distribution
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Summary:The use of fluorescent microthermal imaging (FMI) as a tool to study the temperature distribution in flip chip packages was investigated. Backgrinding of the die was required to minimize heat diffusion and maximize the spatial resolution. A test structure was created in order to evaluate FMI spatial resolution from the backside of flip chips as a function of the die thickness and of the power dissipation. A lateral resolution of 50 /spl mu/m is obtained after polishing the die to a thickness of 5 /spl mu/m. At this thickness, the centre of a hot spot can be located with a precision of /spl plusmn/5 /spl mu/m. For a 5 /spl mu/m thick die, the FMI temperature map revealed the heat-sinking effect of the flip chip's solder bumps.
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.1999.762444