Mechanically Flexible Interconnects With Contact Tip for Rematable Heterogeneous System Integration

A wafer-level, batch-fabricated, mechanically flexible interconnect (MFI) with a contact tip has been developed for rematable heterogeneous system integration. The contact tip, which exhibits a truncated-cone profile, enhances the scrubbing capability while maintaining the tip lifetime by avoiding t...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2016-11, Vol.6 (11), p.1587-1594
Main Authors: Chaoqi Zhang, Hyung Suk Yang, Thacker, Hiren D., Shubin, Ivan, Cunningham, John E., Bakir, Muhannad S.
Format: Article
Language:English
Subjects:
Advanced packaging
Electric contacts
Electrical properties
Electrical resistance measurement
Fabrication
flexible interconnect
heterogeneous integration
Mechanical properties
NiW
Plastic deformation
rematable assembly
Substrates
Surface resistance
Surface treatment
Washing
X-ray imaging
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Description
Summary:A wafer-level, batch-fabricated, mechanically flexible interconnect (MFI) with a contact tip has been developed for rematable heterogeneous system integration. The contact tip, which exhibits a truncated-cone profile, enhances the scrubbing capability while maintaining the tip lifetime by avoiding tip plastic deformation. Electrical and mechanical characterization has been conducted on various testbeds to verify the performance of the assembled chip links with MFIs. The results indicate that a single MFI has an average electrical resistance of 103.21 mQ and up to 1 A current carrying capability, and can be successfully assembled on nonplanar surfaces with up to 45-μm surface variation.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2016.2614997