A course on introduction to electronic packaging

The translation of performance achievable on silicon to the system level requires the intervention of a high performance packaging technology. In high performance systems, the package is more than a mere provider of interconnections, mechanical support and protection. The package can and will active...

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Bibliographic Details
Main Authors: Rao, N.J., Ananda Rao, G.
Format: Conference Proceeding
Language:English
Subjects:
and manufacturing technology
Components
Costs
Electronic packaging thermal management
Electronics packaging
Integrated circuit interconnections
Lead time reduction
packaging
Protection
Semiconductor device packaging
Silicon
Wiring
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Description
Summary:The translation of performance achievable on silicon to the system level requires the intervention of a high performance packaging technology. In high performance systems, the package is more than a mere provider of interconnections, mechanical support and protection. The package can and will actively influence the performance of the circuit and the system. With the lead times for introducing new products continuously getting reduced, it is necessary to manage the interface between the functional design and the package design at the board level. To manage this interface effectively, the electronics hardware designer needs to have a good appreciation of different aspects of packaging. This paper presents the case for a core course to the students of electrical and electronic engineering programme. Detailed syllabus, lecture plans and laboratory exercises related to the proposed course are presented. It is also suggested that a course of this nature should be created for web based instruction.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1999.776289