The problem of boundary data exchange in a hybrid computation of thermal fields in electronic equipment

The paper describes the results of common works of the Technical University of Lodz (TUL) and the Ecole Centrale de Lyon (ECL) to give the software for 3D simulation of sophisticated thermal problems in electronic equipment. Both the programs, one of them developed in TUL, the second one in ECL, are...

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Bibliographic Details
Main Authors: Lisik, Z., Le Helley, M., Lauger, M., Podgorski, J., Kopec, M.
Format: Conference Proceeding
Language:English
Subjects:
Computational modeling
Design optimization
Electronic equipment
Equations
Heat transfer
Numerical simulation
Semiconductor devices
Temperature
Thermal conductivity
Thermal resistance
Online Access:Request full text
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Summary:The paper describes the results of common works of the Technical University of Lodz (TUL) and the Ecole Centrale de Lyon (ECL) to give the software for 3D simulation of sophisticated thermal problems in electronic equipment. Both the programs, one of them developed in TUL, the second one in ECL, are described, as are the boundaries that join them.
ISSN:1093-5142
DOI:10.1109/CIPE.1998.779658