Yield-driven redundant power bump assignment for power network robustness

During package manufacturing process, open defects of power bumps may cause insufficient power supply and degrade the power network yield. This work presents a redundant power bump insertion method to ensure power integrity by considering the power bump yields. The proposed method can efficiently as...

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Bibliographic Details
Main Authors: Yu-Min Lee, Chi-Han Lee, Yan-Cheng Zhu
Format: Conference Proceeding
Language:English
Subjects:
Load modeling
Mathematical model
Power supplies
Robustness
Substrates
Yield estimation
Online Access:Request full text
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Description
Summary:During package manufacturing process, open defects of power bumps may cause insufficient power supply and degrade the power network yield. This work presents a redundant power bump insertion method to ensure power integrity by considering the power bump yields. The proposed method can efficiently assign redundant bumps by accurately estimating the location of worst load yield and minimizing the amounts of redundant bumps to enhance the power network yield.
ISSN:2153-697X
DOI:10.1109/ASPDAC.2017.7858331