Enhanced Lumen Output of LEDs With Die Bonding by Printable Adhesive

A novel printable optically reflective adhesive is introduced to replace optically transparent adhesives for the die bonding of standard mesa type light-emitting diodes (LEDs). The new adhesive shows much lower thermal resistance than the optically transparent ones, and the printed adhesive layer al...

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Bibliographic Details
Published in:IEEE photonics technology letters 2017-07, Vol.29 (13), p.1109-1111
Main Authors: Yu-Chou Shih, Jiun-Pyng You, Shi, Frank G.
Format: Article
Language:English
Subjects:
Die attach adhesive
Light emitting diodes
Microassembly
mid-power LED
Optical films
Optical reflection
Optical scattering
reflective DAA
Reliability
silicone
Thermal conductivity
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Summary:A novel printable optically reflective adhesive is introduced to replace optically transparent adhesives for the die bonding of standard mesa type light-emitting diodes (LEDs). The new adhesive shows much lower thermal resistance than the optically transparent ones, and the printed adhesive layer also shows low fillet coverage around the chip, eliminating the absorption due to the surrounding die attach adhesive materials. The improvement in optical output by using printable optically reflective adhesive is found to be 2.3% points over standard adhesive with 33% fillet coverage. This letter suggests a cost-effective and speedy manufacturing method for mid-power mesa type LEDs, as well as chip-on-board packaging with multiple LED chips.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2017.2703640