Prominent interface structure and bonding material of power module for high temperature operation

Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of sintered Ag bonding may be possible degradation of interfacial strength at high temperatures. Molding process is thus important for supportin...

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Main Authors: Sugiura, Kazuhiko, Iwashige, Tomohito, Kawai, Jun, Tsuruta, Kazuhiro, Chuantong Chen, Nagao, Shijo, Hao Zhang, Sugahara, Tohru, Suganuma, Katsuaki, Kurosaka, Seigo, Sakuma, Yuichi, Oda, Yukinori
Format: Conference Proceeding
Language:eng ; jpn
Subjects:
CoWP metalization
high temperature operation
micro-porous
power module
reliability test
shear strength
SiC
sintered Ag
tungsten compound particles
wide-band-gap semiconductor
WO 3
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Summary:Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of sintered Ag bonding may be possible degradation of interfacial strength at high temperatures. Molding process is thus important for supporting the die-attach in the encapsulated power module once certain adhesion strength is assured between a lead-flame and mold resin. We propose a prominent interface structure using novel bonding materials for electronic power modules targeting high-temperature operation.
ISSN:1946-0201
DOI:10.23919/ISPSD.2017.7988886