Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

The Si micro-fluid cooler, combining micro-jet array impingement, micro-channel flow and micro-trench drainage, has been designed and experimentally evaluated. Enhanced jet array impingement has been achieved by eliminating the negative cross-flow effect among adjacent nozzles. Low thermal resistanc...

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Bibliographic Details
Main Authors: Yong Han, Boon Long Lau, Gongyue Tang, Seow Meng Low, Goh, Jason
Format: Conference Proceeding
Language:English
Subjects:
3D package
Cooling
double-side cooling solution
Heating systems
jet impingement
micro-fluid cooler
Silicon
Substrates
Temperature distribution
Thermal resistance
Three-dimensional displays
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Description
Summary:The Si micro-fluid cooler, combining micro-jet array impingement, micro-channel flow and micro-trench drainage, has been designed and experimentally evaluated. Enhanced jet array impingement has been achieved by eliminating the negative cross-flow effect among adjacent nozzles. Low thermal resistance
ISSN:2377-5726
DOI:10.1109/ECTC.2017.42