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Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization

Thin film electrodes on a flexible substrate have attracted significant interests from the community for developing flexible and wearable electronics. A prompted routine for inkjet printing conductive patterns on a flexible plastic substrate is developed in this study, in which silver ion-based cata...

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Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-09, Vol.7 (9), p.1552-1559
Main Authors: Cai, Wen-Ran, Mei, Jun, Lau, Woon-Ming, Chen, Yan-Qiu, Liu, Yu, Jin, Xiong, Deng, Yong-Qiang, Zhang, Yong-Zhe, Zhang, Jie, Yan, Hui, Gao, Wei-Lian
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Language:English
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Summary:Thin film electrodes on a flexible substrate have attracted significant interests from the community for developing flexible and wearable electronics. A prompted routine for inkjet printing conductive patterns on a flexible plastic substrate is developed in this study, in which silver ion-based catalytic ink is utilized as a seed layer for electroless copper metallization in room temperature. Through optimization of Ag + ink composition and printing process parameters, the pattern definition and continuity of electroless plated Cu have been improved. The resistivity at the same order of 10 -6 Ω · cm as bulk copper is achieved, and the adhesion has passed a variety of mechanical tests. Comprehensive characterizations of the printed samples at various processing stages are carried out and presented in this paper.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2017.2730483