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Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization
Thin film electrodes on a flexible substrate have attracted significant interests from the community for developing flexible and wearable electronics. A prompted routine for inkjet printing conductive patterns on a flexible plastic substrate is developed in this study, in which silver ion-based cata...
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Published in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-09, Vol.7 (9), p.1552-1559 |
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Main Authors: | , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Thin film electrodes on a flexible substrate have attracted significant interests from the community for developing flexible and wearable electronics. A prompted routine for inkjet printing conductive patterns on a flexible plastic substrate is developed in this study, in which silver ion-based catalytic ink is utilized as a seed layer for electroless copper metallization in room temperature. Through optimization of Ag + ink composition and printing process parameters, the pattern definition and continuity of electroless plated Cu have been improved. The resistivity at the same order of 10 -6 Ω · cm as bulk copper is achieved, and the adhesion has passed a variety of mechanical tests. Comprehensive characterizations of the printed samples at various processing stages are carried out and presented in this paper. |
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ISSN: | 2156-3950 2156-3985 |
DOI: | 10.1109/TCPMT.2017.2730483 |