Tools for system specific packaging for electro-mechanical systems

While some electronics systems are stand-alone, frequently electronics is integrated with other, perhaps mechanical sub-systems to create hybrid products such as those encountered in automotive, aerospace and military systems and products. The creation of such products requires the ability to design...

Full description

Saved in:
Bibliographic Details
Main Authors: Hyslop, S.M., Palmer, P.J., Williams, D.J.
Format: Conference Proceeding
Language:English
Subjects:
Aerospace electronics
Application software
Automotive engineering
Electronic packaging thermal management
Electronics packaging
Engineering management
Manufacturing
Prototypes
Thermal management
Thermal management of electronics
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:While some electronics systems are stand-alone, frequently electronics is integrated with other, perhaps mechanical sub-systems to create hybrid products such as those encountered in automotive, aerospace and military systems and products. The creation of such products requires the ability to design and manufacture both electronic and mechanical sub-systems and to manage the interactions and interfaces between these sub-systems during design and prototyping and at manufacture. This paper explores some of the problems inherent in the creation and application of such systems and identifies some of the tools that exist to support resolution of these problems. Typical challenges facing senior systems engineers, whose task it is to realise such products, include the partitioning of electronics and software systems, electronics packaging-including "box-to-box" connectivity, thermal management and reliability enhancement, the management of space and centre of gravity, and the integration of mechanisms and actuation systems.
ISSN:1089-8190
2576-9626
DOI:10.1109/IEMT.1999.804851