Design for (physical) debug for silicon microsurgery and probing of flip-chip packaged integrated circuits

As transistor technology shrinks, well-planned structures for debug must be designed into the circuitry. Analyzing signals from the backside using pre-planned probing structures, or fixing logic or speed bugs using on-silicon microsurgery has become even more important as the photomasks and other li...

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Bibliographic Details
Main Authors: Livengood, R.H., Medeiros, D.
Format: Conference Proceeding
Language:English
Subjects:
Circuit analysis
Computer bugs
Costs
Logic
Microsurgery
Signal analysis
Silicon
Surgery
Throughput
Transistors
Online Access:Request full text
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Description
Summary:As transistor technology shrinks, well-planned structures for debug must be designed into the circuitry. Analyzing signals from the backside using pre-planned probing structures, or fixing logic or speed bugs using on-silicon microsurgery has become even more important as the photomasks and other lithographic costs climb. Quick and reliable throughput of silicon fixes is critical to the success of debug, which multi-layer tapeouts cannot provide in a timely fashion.
ISSN:1089-3539
2378-2250
DOI:10.1109/TEST.1999.805819