Loading…

A controlled, mechanical method for MEMS decapsulation

As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliabi...

Full description

Saved in:
Bibliographic Details
Main Authors: Hao Tan, Moyal, Efrat, Huei Hao Yap, Yu Zhe Zhao, Ran He, Yin Zhe Ma, Bing Hai Liu, Chang Qing Chen, Pik Kee Tan, Lam, Jeffrey, Zhi Hong Mai
Format: Conference Proceeding
Language:English
Subjects:
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by
cites
container_end_page 4
container_issue
container_start_page 1
container_title
container_volume
creator Hao Tan
Moyal, Efrat
Huei Hao Yap
Yu Zhe Zhao
Ran He
Yin Zhe Ma
Bing Hai Liu
Chang Qing Chen
Pik Kee Tan
Lam, Jeffrey
Zhi Hong Mai
description As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role in the process development and the success rate for MEMS FA will be critical. In this paper, we will discuss a new decapsulation approach using a wedge diamond indenter based tool. It is a pure mechanical method and most of all, the whole process can be visually guided and monitored with the onboard optical vision system. The precision knob based operation is controllable, which makes the success rate very high by every user. We have successfully applied this method to our MEMS FA cases and this paper will detail our experiences.
doi_str_mv 10.1109/IPFA.2017.8060184
format conference_proceeding
fullrecord <record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_8060184</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>8060184</ieee_id><sourcerecordid>8060184</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-a86ae1f88ee3dcc784ed7b799f18fcd02d49c3658e03d4999c70bb0ae511c3d43</originalsourceid><addsrcrecordid>eNotj8FKw0AURUdBsNR8gLjJB5j4XiYzb2YZSmsLLQrqukxmXuhImpQkLvx7A3Z1Dmdx4QrxiJAjgn3ZvW-qvACk3IAGNOWNSCwZVNJoJLLyVizQljpDpeBeJOP4DQBYGF0QLYSuUt9309C3LYfn9Mz-5LroXTvrdOpD2vRDelgfPtLA3l3Gn9ZNse8exF3j2pGTK5fia7P-XG2z_dvrblXts4ikpswZ7RgbY5hl8J5MyYFqsrZB0_gARSitl1oZBjmrtZ6grsGxQvRzkUvx9L8bmfl4GeLZDb_H61P5BwJfRno</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>A controlled, mechanical method for MEMS decapsulation</title><source>IEEE Xplore All Conference Series</source><creator>Hao Tan ; Moyal, Efrat ; Huei Hao Yap ; Yu Zhe Zhao ; Ran He ; Yin Zhe Ma ; Bing Hai Liu ; Chang Qing Chen ; Pik Kee Tan ; Lam, Jeffrey ; Zhi Hong Mai</creator><creatorcontrib>Hao Tan ; Moyal, Efrat ; Huei Hao Yap ; Yu Zhe Zhao ; Ran He ; Yin Zhe Ma ; Bing Hai Liu ; Chang Qing Chen ; Pik Kee Tan ; Lam, Jeffrey ; Zhi Hong Mai</creatorcontrib><description>As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role in the process development and the success rate for MEMS FA will be critical. In this paper, we will discuss a new decapsulation approach using a wedge diamond indenter based tool. It is a pure mechanical method and most of all, the whole process can be visually guided and monitored with the onboard optical vision system. The precision knob based operation is controllable, which makes the success rate very high by every user. We have successfully applied this method to our MEMS FA cases and this paper will detail our experiences.</description><identifier>EISSN: 1946-1550</identifier><identifier>EISBN: 9781538617793</identifier><identifier>EISBN: 153861779X</identifier><identifier>DOI: 10.1109/IPFA.2017.8060184</identifier><language>eng</language><publisher>IEEE</publisher><subject>Diamond ; Failure analysis ; Force ; Machine vision ; Micromechanical devices ; Monitoring ; Reliability</subject><ispartof>2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-4</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8060184$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,27925,54555,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/8060184$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Hao Tan</creatorcontrib><creatorcontrib>Moyal, Efrat</creatorcontrib><creatorcontrib>Huei Hao Yap</creatorcontrib><creatorcontrib>Yu Zhe Zhao</creatorcontrib><creatorcontrib>Ran He</creatorcontrib><creatorcontrib>Yin Zhe Ma</creatorcontrib><creatorcontrib>Bing Hai Liu</creatorcontrib><creatorcontrib>Chang Qing Chen</creatorcontrib><creatorcontrib>Pik Kee Tan</creatorcontrib><creatorcontrib>Lam, Jeffrey</creatorcontrib><creatorcontrib>Zhi Hong Mai</creatorcontrib><title>A controlled, mechanical method for MEMS decapsulation</title><title>2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</title><addtitle>IPFA</addtitle><description>As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role in the process development and the success rate for MEMS FA will be critical. In this paper, we will discuss a new decapsulation approach using a wedge diamond indenter based tool. It is a pure mechanical method and most of all, the whole process can be visually guided and monitored with the onboard optical vision system. The precision knob based operation is controllable, which makes the success rate very high by every user. We have successfully applied this method to our MEMS FA cases and this paper will detail our experiences.</description><subject>Diamond</subject><subject>Failure analysis</subject><subject>Force</subject><subject>Machine vision</subject><subject>Micromechanical devices</subject><subject>Monitoring</subject><subject>Reliability</subject><issn>1946-1550</issn><isbn>9781538617793</isbn><isbn>153861779X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2017</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotj8FKw0AURUdBsNR8gLjJB5j4XiYzb2YZSmsLLQrqukxmXuhImpQkLvx7A3Z1Dmdx4QrxiJAjgn3ZvW-qvACk3IAGNOWNSCwZVNJoJLLyVizQljpDpeBeJOP4DQBYGF0QLYSuUt9309C3LYfn9Mz-5LroXTvrdOpD2vRDelgfPtLA3l3Gn9ZNse8exF3j2pGTK5fia7P-XG2z_dvrblXts4ikpswZ7RgbY5hl8J5MyYFqsrZB0_gARSitl1oZBjmrtZ6grsGxQvRzkUvx9L8bmfl4GeLZDb_H61P5BwJfRno</recordid><startdate>201707</startdate><enddate>201707</enddate><creator>Hao Tan</creator><creator>Moyal, Efrat</creator><creator>Huei Hao Yap</creator><creator>Yu Zhe Zhao</creator><creator>Ran He</creator><creator>Yin Zhe Ma</creator><creator>Bing Hai Liu</creator><creator>Chang Qing Chen</creator><creator>Pik Kee Tan</creator><creator>Lam, Jeffrey</creator><creator>Zhi Hong Mai</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201707</creationdate><title>A controlled, mechanical method for MEMS decapsulation</title><author>Hao Tan ; Moyal, Efrat ; Huei Hao Yap ; Yu Zhe Zhao ; Ran He ; Yin Zhe Ma ; Bing Hai Liu ; Chang Qing Chen ; Pik Kee Tan ; Lam, Jeffrey ; Zhi Hong Mai</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-a86ae1f88ee3dcc784ed7b799f18fcd02d49c3658e03d4999c70bb0ae511c3d43</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Diamond</topic><topic>Failure analysis</topic><topic>Force</topic><topic>Machine vision</topic><topic>Micromechanical devices</topic><topic>Monitoring</topic><topic>Reliability</topic><toplevel>online_resources</toplevel><creatorcontrib>Hao Tan</creatorcontrib><creatorcontrib>Moyal, Efrat</creatorcontrib><creatorcontrib>Huei Hao Yap</creatorcontrib><creatorcontrib>Yu Zhe Zhao</creatorcontrib><creatorcontrib>Ran He</creatorcontrib><creatorcontrib>Yin Zhe Ma</creatorcontrib><creatorcontrib>Bing Hai Liu</creatorcontrib><creatorcontrib>Chang Qing Chen</creatorcontrib><creatorcontrib>Pik Kee Tan</creatorcontrib><creatorcontrib>Lam, Jeffrey</creatorcontrib><creatorcontrib>Zhi Hong Mai</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hao Tan</au><au>Moyal, Efrat</au><au>Huei Hao Yap</au><au>Yu Zhe Zhao</au><au>Ran He</au><au>Yin Zhe Ma</au><au>Bing Hai Liu</au><au>Chang Qing Chen</au><au>Pik Kee Tan</au><au>Lam, Jeffrey</au><au>Zhi Hong Mai</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>A controlled, mechanical method for MEMS decapsulation</atitle><btitle>2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</btitle><stitle>IPFA</stitle><date>2017-07</date><risdate>2017</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><eissn>1946-1550</eissn><eisbn>9781538617793</eisbn><eisbn>153861779X</eisbn><abstract>As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role in the process development and the success rate for MEMS FA will be critical. In this paper, we will discuss a new decapsulation approach using a wedge diamond indenter based tool. It is a pure mechanical method and most of all, the whole process can be visually guided and monitored with the onboard optical vision system. The precision knob based operation is controllable, which makes the success rate very high by every user. We have successfully applied this method to our MEMS FA cases and this paper will detail our experiences.</abstract><pub>IEEE</pub><doi>10.1109/IPFA.2017.8060184</doi><tpages>4</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier EISSN: 1946-1550
ispartof 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-4
issn 1946-1550
language eng
recordid cdi_ieee_primary_8060184
source IEEE Xplore All Conference Series
subjects Diamond
Failure analysis
Force
Machine vision
Micromechanical devices
Monitoring
Reliability
title A controlled, mechanical method for MEMS decapsulation
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T05%3A36%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=A%20controlled,%20mechanical%20method%20for%20MEMS%20decapsulation&rft.btitle=2017%20IEEE%2024th%20International%20Symposium%20on%20the%20Physical%20and%20Failure%20Analysis%20of%20Integrated%20Circuits%20(IPFA)&rft.au=Hao%20Tan&rft.date=2017-07&rft.spage=1&rft.epage=4&rft.pages=1-4&rft.eissn=1946-1550&rft_id=info:doi/10.1109/IPFA.2017.8060184&rft.eisbn=9781538617793&rft.eisbn_list=153861779X&rft_dat=%3Cieee_CHZPO%3E8060184%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i175t-a86ae1f88ee3dcc784ed7b799f18fcd02d49c3658e03d4999c70bb0ae511c3d43%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=8060184&rfr_iscdi=true