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Overcoming the reliability limitation in the ultimately scaled DRAM using silicon migration technique by hydrogen annealing
We demonstrated a highly reliable buried-gate saddle-fin cell-transistor (cell-TR) using silicon migration technique of hydrogen (H 2 ) annealing after a dry etch to form the saddle-fin in a fully integrated 2y-nm 4Gb DRAM. It clearly shows a reduction in interface trap density with highly enhanced...
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creator | Seong-Wan Ryu Kyungkyu Min Jungho Shin Heimi Kwon Donghoon Nam Taekyung Oh Tae-Su Jang Minsoo Yoo Yongtaik Kim Sungjoo Hong |
description | We demonstrated a highly reliable buried-gate saddle-fin cell-transistor (cell-TR) using silicon migration technique of hydrogen (H 2 ) annealing after a dry etch to form the saddle-fin in a fully integrated 2y-nm 4Gb DRAM. It clearly shows a reduction in interface trap density with highly enhanced variable-retention-time (VRT) and Row-Hammering immunity. |
doi_str_mv | 10.1109/IEDM.2017.8268437 |
format | conference_proceeding |
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identifier | EISSN: 2156-017X |
ispartof | 2017 IEEE International Electron Devices Meeting (IEDM), 2017, p.21.6.1-21.6.4 |
issn | 2156-017X |
language | eng |
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source | IEEE Xplore All Conference Series |
subjects | Fabrication Hafnium hydrogen anneal interface trap VRT and Row-Hammering Random access memory saddle finfet |
title | Overcoming the reliability limitation in the ultimately scaled DRAM using silicon migration technique by hydrogen annealing |
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