Embedded ceramic interconnect bridge in organic substrate for heterogeneous integration and multi-chip packaging

In this paper, we describe the architecture and performance of a fine pitch multi-chip heterogeneous integration solution using embedded ceramic interconnect bridge (ECIB) in organic substrate package. We present the increased IO density and the improvement of electrical high-speed performance on si...

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Bibliographic Details
Main Author: Boping Wu
Format: Conference Proceeding
Language:English
Subjects:
3D interconnects
ball-grid array
ceramic bridge
Field-flow fractionation
fine pitch
heterogeneous integration
integrated circuit
multi-chip
organic substrate
system-in-package
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Description
Summary:In this paper, we describe the architecture and performance of a fine pitch multi-chip heterogeneous integration solution using embedded ceramic interconnect bridge (ECIB) in organic substrate package. We present the increased IO density and the improvement of electrical high-speed performance on signal integrity are achievable through this novel integration scheme, where small ceramic elements are embedded and served as interconnect bridges in organic substrate.
ISSN:2151-1233
DOI:10.1109/EDAPS.2017.8277050