Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging

In order to develop the flux dipping process, a quantitative mathematical model that accurately describes the flux dipping process in the flip-chip bonding is proposed. The whole dynamic dipping process is captured by the high-speed transient imaging followed by image processing. Curve fitting of ex...

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Bibliographic Details
Published in:IEEE transactions on industrial informatics 2018-11, Vol.14 (11), p.4746-4754
Main Authors: Li, Junhui, Tian, Qing, Zhang, Haoliang, Chen, Xinxin, Liu, Xiaohe, Zhu, Wenhui
Format: Article
Language:English
Subjects:
Bonding
Cameras
Curve fitting
Dipping
dipping mathematical model
Electronic packaging
Fitting
flip chip
Flip chip soldering
Flip-chip devices
Flux
Image processing
Mathematical model
Mathematical models
microelectronics packaging
Process parameters
Quadratic equations
Viscosity
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Summary:In order to develop the flux dipping process, a quantitative mathematical model that accurately describes the flux dipping process in the flip-chip bonding is proposed. The whole dynamic dipping process is captured by the high-speed transient imaging followed by image processing. Curve fitting of experimental results yields the relation between flux dipping quantity and process parameters. It suggests a quadratic function of quantity ( Q) with respect to dipping depth ( d), and a piece-wise function to dipping speed ( v) including an exponential section and a quadratic or linear section. While the coupled effect of d and v can be expressed as a merged function of Q= f_{(d,v)}, these mathematical models are proved to be effective when applied to the actual dipping process practiced on a flip-chip bonding machine, thus providing a reliable mathematical basis for optimizing dipping flux in industrial manufacturing.
ISSN:1551-3203
1941-0050
DOI:10.1109/TII.2018.2805297