Cooling of semiconductor electronics to cryogenic temperature: meeting DoD needs

Many of the issues and associated opportunities for cryogenic cooling of electronic devices, components and systems are discussed. The technical issues associated with packaging and refrigeration for cryogenic operation of electronic components are examined along with possible approaches to overcome...

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Bibliographic Details
Main Author: Nisenoff, M.
Format: Conference Proceeding
Language:English
Subjects:
Cryogenics
Electronic components
Electronics cooling
Electronics packaging
High performance computing
Moore's Law
Sensor fusion
Signal processing
Temperature sensors
Throughput
Online Access:Request full text
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Description
Summary:Many of the issues and associated opportunities for cryogenic cooling of electronic devices, components and systems are discussed. The technical issues associated with packaging and refrigeration for cryogenic operation of electronic components are examined along with possible approaches to overcome the reluctance on the part of the customer to use cryogenic systems ("cryophobia").
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.2000.837073