Characterization and processing of thick film materials for MCM-C applications

The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is d...

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Bibliographic Details
Main Authors: Jovanovic, D., Stojkovic, D., Ramovic, R., Lutovac, M.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Circuit testing
Conductors
Dielectrics
Insulation life
Nonhomogeneous media
Resistors
Silver
Thick films
Wire
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Summary:The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is described. Electrical and physical characterization of multilayer thick film materials based on alumina substrate is detailed. Test results with DuPonts QM silver-based system materials for low-cost multilayers have provided design and process recommendations.
DOI:10.1109/ICMEL.2000.838746