Characterization and processing of thick film materials for MCM-C applications

The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is d...

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Main Authors: Jovanovic, D., Stojkovic, D., Ramovic, R., Lutovac, M.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Circuit testing
Conductors
Dielectrics
Insulation life
Nonhomogeneous media
Resistors
Silver
Thick films
Wire
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creator Jovanovic, D.
Stojkovic, D.
Ramovic, R.
Lutovac, M.
description The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is described. Electrical and physical characterization of multilayer thick film materials based on alumina substrate is detailed. Test results with DuPonts QM silver-based system materials for low-cost multilayers have provided design and process recommendations.
doi_str_mv 10.1109/ICMEL.2000.838746
format conference_proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_838746</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>838746</ieee_id><sourcerecordid>838746</sourcerecordid><originalsourceid>FETCH-LOGICAL-i87t-ccdb22173a435c80c081c22a80e6eb24d8176749206a499847a5e027790567173</originalsourceid><addsrcrecordid>eNotj8tOwzAURC0hJKD0A2DlH0i5fsX2ElkFKiWw6b66dRxqyEt2NvD1BMpqFmfOSEPIHYMNY2Afdq7eVhsOABsjjJblBbkBbUAoLhS7IuucPxYIwippzDV5dSdM6OeQ4jfOcRwoDg2d0uhDznF4p2NL51P0n7SNXU97_G1il2k7Jlq7unAUp6mL_k_Ot-SyXWhY_-eK7J-2e_dSVG_PO_dYFdHoufC-OXLOtEAplDfgwTDPORoIZThy2RimSy0thxKltUZqVAG41hZUqRdvRe7PszGEcJhS7DF9Hc6HxQ_iIkrc</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Characterization and processing of thick film materials for MCM-C applications</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Jovanovic, D. ; Stojkovic, D. ; Ramovic, R. ; Lutovac, M.</creator><creatorcontrib>Jovanovic, D. ; Stojkovic, D. ; Ramovic, R. ; Lutovac, M.</creatorcontrib><description>The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is described. Electrical and physical characterization of multilayer thick film materials based on alumina substrate is detailed. Test results with DuPonts QM silver-based system materials for low-cost multilayers have provided design and process recommendations.</description><identifier>ISBN: 0780352351</identifier><identifier>ISBN: 9780780352353</identifier><identifier>DOI: 10.1109/ICMEL.2000.838746</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bonding ; Circuit testing ; Conductors ; Dielectrics ; Insulation life ; Nonhomogeneous media ; Resistors ; Silver ; Thick films ; Wire</subject><ispartof>2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400), 2000, Vol.2, p.527-529 vol.2</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/838746$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/838746$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Jovanovic, D.</creatorcontrib><creatorcontrib>Stojkovic, D.</creatorcontrib><creatorcontrib>Ramovic, R.</creatorcontrib><creatorcontrib>Lutovac, M.</creatorcontrib><title>Characterization and processing of thick film materials for MCM-C applications</title><title>2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)</title><addtitle>ICMEL</addtitle><description>The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is described. Electrical and physical characterization of multilayer thick film materials based on alumina substrate is detailed. Test results with DuPonts QM silver-based system materials for low-cost multilayers have provided design and process recommendations.</description><subject>Bonding</subject><subject>Circuit testing</subject><subject>Conductors</subject><subject>Dielectrics</subject><subject>Insulation life</subject><subject>Nonhomogeneous media</subject><subject>Resistors</subject><subject>Silver</subject><subject>Thick films</subject><subject>Wire</subject><isbn>0780352351</isbn><isbn>9780780352353</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2000</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotj8tOwzAURC0hJKD0A2DlH0i5fsX2ElkFKiWw6b66dRxqyEt2NvD1BMpqFmfOSEPIHYMNY2Afdq7eVhsOABsjjJblBbkBbUAoLhS7IuucPxYIwippzDV5dSdM6OeQ4jfOcRwoDg2d0uhDznF4p2NL51P0n7SNXU97_G1il2k7Jlq7unAUp6mL_k_Ot-SyXWhY_-eK7J-2e_dSVG_PO_dYFdHoufC-OXLOtEAplDfgwTDPORoIZThy2RimSy0thxKltUZqVAG41hZUqRdvRe7PszGEcJhS7DF9Hc6HxQ_iIkrc</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Jovanovic, D.</creator><creator>Stojkovic, D.</creator><creator>Ramovic, R.</creator><creator>Lutovac, M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2000</creationdate><title>Characterization and processing of thick film materials for MCM-C applications</title><author>Jovanovic, D. ; Stojkovic, D. ; Ramovic, R. ; Lutovac, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i87t-ccdb22173a435c80c081c22a80e6eb24d8176749206a499847a5e027790567173</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Bonding</topic><topic>Circuit testing</topic><topic>Conductors</topic><topic>Dielectrics</topic><topic>Insulation life</topic><topic>Nonhomogeneous media</topic><topic>Resistors</topic><topic>Silver</topic><topic>Thick films</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Jovanovic, D.</creatorcontrib><creatorcontrib>Stojkovic, D.</creatorcontrib><creatorcontrib>Ramovic, R.</creatorcontrib><creatorcontrib>Lutovac, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jovanovic, D.</au><au>Stojkovic, D.</au><au>Ramovic, R.</au><au>Lutovac, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Characterization and processing of thick film materials for MCM-C applications</atitle><btitle>2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)</btitle><stitle>ICMEL</stitle><date>2000</date><risdate>2000</risdate><volume>2</volume><spage>527</spage><epage>529 vol.2</epage><pages>527-529 vol.2</pages><isbn>0780352351</isbn><isbn>9780780352353</isbn><abstract>The application of the new low-cost series thick film materials for multilayer structure with four metal layers is discussed in this paper. Processing of multilayer test structure used to evaluate properties of new materials for HDI MCM (High Density Integration Multi Chip Modules) applications is described. Electrical and physical characterization of multilayer thick film materials based on alumina substrate is detailed. Test results with DuPonts QM silver-based system materials for low-cost multilayers have provided design and process recommendations.</abstract><pub>IEEE</pub><doi>10.1109/ICMEL.2000.838746</doi></addata></record>
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Bonding
Circuit testing
Conductors
Dielectrics
Insulation life
Nonhomogeneous media
Resistors
Silver
Thick films
Wire
title Characterization and processing of thick film materials for MCM-C applications
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T05%3A12%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Characterization%20and%20processing%20of%20thick%20film%20materials%20for%20MCM-C%20applications&rft.btitle=2000%2022nd%20International%20Conference%20on%20Microelectronics.%20Proceedings%20(Cat.%20No.00TH8400)&rft.au=Jovanovic,%20D.&rft.date=2000&rft.volume=2&rft.spage=527&rft.epage=529%20vol.2&rft.pages=527-529%20vol.2&rft.isbn=0780352351&rft.isbn_list=9780780352353&rft_id=info:doi/10.1109/ICMEL.2000.838746&rft_dat=%3Cieee_6IE%3E838746%3C/ieee_6IE%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i87t-ccdb22173a435c80c081c22a80e6eb24d8176749206a499847a5e027790567173%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=838746&rfr_iscdi=true