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Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

This paper presents a wafer-level pre-packaging technology for power devices. The concept consists in the implementation of a thick 3D patterned copper leadframe ensuring the interconnections of the power devices among them or with the other components of the converter. The metallic leadframe is bon...

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Main Authors:	Vladimirova, Kremena, Widiez, Julie, Letowski, Bastien, Perreau, Pierre, Enyedi, Gregory, Coudrain, Perceval, Rouger, Nicolas, Crebier, Jean-Christophe
Format:	Conference Proceeding
Language:	English
Subjects:	3D power module Bonding Copper die-level packaging direct copper bonding Electrodes Lead metallic leadframe power electronics solderless module Stacking Switches Three-dimensional displays wafer-level packaging wire bondless module
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creator	Vladimirova, Kremena Widiez, Julie Letowski, Bastien Perreau, Pierre Enyedi, Gregory Coudrain, Perceval Rouger, Nicolas Crebier, Jean-Christophe
description	This paper presents a wafer-level pre-packaging technology for power devices. The concept consists in the implementation of a thick 3D patterned copper leadframe ensuring the interconnections of the power devices among them or with the other components of the converter. The metallic leadframe is bonded between two wafers of semiconductor devices enabling the 3D power module integration by the 3D stacking of one or multiple switching cells. Specific technology developments are introduced, practical realizations of the concept are presented and the electrical characterizations of the first prototypes are discussed.
doi_str_mv	10.1109/ECTC.2018.00193
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source	IEEE Xplore All Conference Series
subjects	3D power module Bonding Copper die-level packaging direct copper bonding Electrodes Lead metallic leadframe power electronics solderless module Stacking Switches Three-dimensional displays wafer-level packaging wire bondless module
title	Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics
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