Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Intel's commitment to the environment continues with a breakthrough technology - Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will also discuss the process, material, design opti...

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Bibliographic Details
Main Authors: Sahasrabudhe, Shubhada, Mokler, Scott, Renavikar, Mukul, Sane, Sandeep, Byrd, Kevin, Brigham, Eric, Jin, Owen, Goonetilleke, Pubudu, Badwe, Nilesh, Parupalli, Satish
Format: Conference Proceeding
Language:English
Subjects:
Green manufacturing
Low Temperature Solder
Metals
Ovens
Reliability
Solder Joint Reliability
Soldering
Surface Mount Technology
Temperature measurement
Online Access:Request full text
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Summary:Intel's commitment to the environment continues with a breakthrough technology - Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will also discuss the process, material, design optimization efforts performed in order to ensure Yield, Quality and Reliability goals are met. Manufacturability and mechanical/ thermomechanical solder joint reliability data will be shared to demonstrate the impact of key technical modulators.
ISSN:2377-5726
DOI:10.1109/ECTC.2018.00222