Silica-Based Packaging Structure for D-band RF module

This paper presents a packaging structure in D-band, which is a stacked structure of a silica-based substrate, a print wiring board, and a metal chassis. Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good...

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Bibliographic Details
Main Authors: Ito, Masaharu, Marumoto, Tsunehisa
Format: Conference Proceeding
Language:English
Subjects:
Band-pass filters
dielectric substrates
electromagnetic propagation
Frequency measurement
Metals
millimeter wave devices
Packaging
Polyimides
Silicon compounds
Substrates
wireless communication
Online Access:Request full text
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Description
Summary:This paper presents a packaging structure in D-band, which is a stacked structure of a silica-based substrate, a print wiring board, and a metal chassis. Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. The fabricated three-resonator filters show small deviations in frequency responses among samples along with good filter performances.
ISSN:2576-7216
DOI:10.1109/MWSYM.2018.8439218