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Silica-Based Packaging Structure for D-band RF module

This paper presents a packaging structure in D-band, which is a stacked structure of a silica-based substrate, a print wiring board, and a metal chassis. Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good...

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Main Authors:	Ito, Masaharu, Marumoto, Tsunehisa
Format:	Conference Proceeding
Language:	English
Subjects:	Band-pass filters dielectric substrates electromagnetic propagation Frequency measurement Metals millimeter wave devices Packaging Polyimides Silicon compounds Substrates wireless communication
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creator	Ito, Masaharu Marumoto, Tsunehisa
description	This paper presents a packaging structure in D-band, which is a stacked structure of a silica-based substrate, a print wiring board, and a metal chassis. Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. The fabricated three-resonator filters show small deviations in frequency responses among samples along with good filter performances.
doi_str_mv	10.1109/MWSYM.2018.8439218
format	conference_proceeding
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Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. 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Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. 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Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. The fabricated three-resonator filters show small deviations in frequency responses among samples along with good filter performances.</abstract><pub>IEEE</pub><doi>10.1109/MWSYM.2018.8439218</doi><tpages>4</tpages></addata></record>
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source	IEEE Xplore All Conference Series
subjects	Band-pass filters dielectric substrates electromagnetic propagation Frequency measurement Metals millimeter wave devices Packaging Polyimides Silicon compounds Substrates wireless communication
title	Silica-Based Packaging Structure for D-band RF module
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