Wafer-level chip scale packaging: benefits for integrated passive devices

Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions. The term chip scale package (CSP) has become synonymous with "fine pitch BGA" as the distinction between a ball grid array (EGA) and some chip scale packages beco...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2000-05, Vol.23 (2), p.247-251
Main Authors: Clearfield, H.M., Young, J.L., Wijeyesekera, S.D., Logan, E.A.
Format: Article
Language:English
Subjects:
Applied sciences
Arrays
Assembly
Cellular phones
Chip formation
Chip scale packaging
Chips
Costs
Design. Technologies. Operation analysis. Testing
Devices
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Electronics packaging
Exact sciences and technology
Form factors
Handheld computers
Integrated circuits
Microelectronics: LSI, VLSI, ULSI
integrated circuit fabrication technology
Packages
Packaging
Plastic packaging
Radio frequency
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Thin film devices
Wafer scale integration
Wafers
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Summary:Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions. The term chip scale package (CSP) has become synonymous with "fine pitch BGA" as the distinction between a ball grid array (EGA) and some chip scale packages becomes nearly indistinguishable. The cost of chip scale packages also continues to draw attention as one of the barriers to wide scale industry adoption. Sometimes lost in the chip scale debate is the discussion about wafer level chip scale packages, which offer the fastest path to small form factor, high performance and cost effective solutions. In this paper, we describe an approach to wafer level chip scale packaging that is an extension of integrated passive device processing, which results in low cost.
ISSN:1521-3323
1557-9980
DOI:10.1109/6040.846642