Reliability of flip chip BGA package on organic substrate

In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.

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Bibliographic Details
Main Authors: Eun-Chul Ahn, Tae-Je Cho, Jong-Bo Shin, Ho-Joong Moon, Ju-Hyun Lyu, Ki-Won Choi, Sa-Yoon Kang, Se-Yong Oh
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Electronic packaging thermal management
Electronics packaging
Flip chip
Moon
Random access memory
Testing
Thermal stresses
Vehicles
Wire
Online Access:Request full text
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Description
Summary:In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
DOI:10.1109/ECTC.2000.853328