Reliability of flip chip BGA package on organic substrate

In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.

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Main Authors: Eun-Chul Ahn, Tae-Je Cho, Jong-Bo Shin, Ho-Joong Moon, Ju-Hyun Lyu, Ki-Won Choi, Sa-Yoon Kang, Se-Yong Oh
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Electronic packaging thermal management
Electronics packaging
Flip chip
Moon
Random access memory
Testing
Thermal stresses
Vehicles
Wire
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container_start_page 1215
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creator Eun-Chul Ahn
Tae-Je Cho
Jong-Bo Shin
Ho-Joong Moon
Ju-Hyun Lyu
Ki-Won Choi
Sa-Yoon Kang
Se-Yong Oh
description In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
doi_str_mv 10.1109/ECTC.2000.853328
format conference_proceeding
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ispartof 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.1215-1220
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Bonding
Electronic packaging thermal management
Electronics packaging
Flip chip
Moon
Random access memory
Testing
Thermal stresses
Vehicles
Wire
title Reliability of flip chip BGA package on organic substrate
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