A web based course on designing high density interconnect PCBs for manufacturability

• Main Authors: Ananda Rao, G., Rao, N.J.
• Format: Conference Proceeding
• Language: English
• Subjects: Assembly; Availability; Chip scale packaging; Consumer electronics; Context; Costs; Design for manufacture; Electronics packaging; Manufacturing processes; Product design
• DOI: 10.1109/ECTC.2000.853340

The design of high density interconnects (HDI) PCBs is an important step in design and development of present day electronic products. This design is becoming a complex task with the availability of a large number of process technologies. Each technology offers its own cost (yield)/volume/performance optimisation. The designer should be able to do the package design in the context of a selected manufacturing technology, and communicate effectively with the fabricator. This process may be termed as "design for manufacturability" (DFM). While DFM issues are not new to an electronic/PCB designer, these acquire new importance in the context of proliferation of manufacturing processes and increasing performance requirements. In addition, these issues are in a constant state of flux, as process changes and new processes are being introduced on a continuing basis. Consequently, there is a need for the designer to continuously keep track of process improvements, and take advantage of them to make his product more competitive. This paper presents the structure of a course on "design of HDI PCBs for manufacturability". While it is designed as a second level course on electronic packaging, that can be offered at graduate level. As a larger number of practising engineers are likely to be interested in such a course, it is proposed to make it web based.