Comparative Study on Modeling Approaches of V-Shaped MEMS Temperature Sensors

Thermal microelectromechanical system (MEMS) devices have gained immensely in popularity due to their good performances, relatively simple fabrication process, and to the availability of modeling tools. In this paper, the modeling results of several models were compared and the ability of each to re...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on instrumentation and measurement 2019-10, Vol.68 (10), p.3766-3775
Main Authors: Cohen, Yaniv, Ya'akobovitz, Assaf
Format: Article
Language:English
Subjects:
Comparative studies
Deflection
Devices
Equations of motion
Finite element method
Iterative methods
Mathematical model
Microelectromechanical systems
Micromechanical devices
Performance evaluation
Reliability analysis
Residual stress
Signal to noise ratio
Stiffness
Substrates
Temperature dependence
Temperature sensors
Thermal expansion
thermal microelectromechanical system (MEMS)
Tolerances
V-shaped MEMS devices
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Thermal microelectromechanical system (MEMS) devices have gained immensely in popularity due to their good performances, relatively simple fabrication process, and to the availability of modeling tools. In this paper, the modeling results of several models were compared and the ability of each to reliably assess the performances of V-shaped thermal MEMS devices was investigated. The results of several models, in which the governing equations of motion were directly solved, were compared to those obtained from nonlinear large-deflection 3-D finite element analysis that was verified experimentally. The models were modified by including the temperature-dependent properties of the material of the device. In addition, a numerical iterative force control solution scheme was developed and used to predict the performances of V-shaped devices. Important parameters of V-shaped devices, such as apex deflection, stiffness, and output force, were evaluated in terms of the applied temperature and device geometry. In addition, the feasibility of capacitive sensing was demonstrated and high signal-to-noise ratio was calculated. Finally, the influence of microfabrication tolerances and internal stress on the performances of the devices were studied. Therefore, this paper will help future researchers and designers to assess the reliability of models of thermal MEMS devices and better evaluate device performance.
ISSN:0018-9456
1557-9662
DOI:10.1109/TIM.2018.2879144