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Investigation of Ta2O5 as an Alternative High- Dielectric for InAlN/GaN MOS-HEMT on Si
We report on the demonstration and investigation of Ta 2 O 5 as high-k dielectric for InAlN/GaN-MOS high-electron mobility transistor (HEMT)-on-Si. Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition annea...
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Published in: | IEEE transactions on electron devices 2019-03, Vol.66 (3), p.1230-1235 |
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Main Authors: | , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | We report on the demonstration and investigation of Ta 2 O 5 as high-k dielectric for InAlN/GaN-MOS high-electron mobility transistor (HEMT)-on-Si. Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal (PDA) conditions. The gate leakage was 16 nA/mm at −15 V which was ~five orders of magnitude lower compared to reference HEMT. The 2-D electron gas (2-DEG) density was found to vary with annealing temperature suggesting the presence of net charge at the Ta 2 O 5 /InAlN interface. Dispersion in the capacitance-voltage ( {C} - {V} ) characteristics was used to estimate the frequency-dependent interface charge, while energy band diagrams under flat band conditions were investigated to estimate fixed charge. The optimum anneal condition was found to be 500 °C which has resulted into a flat band voltage spread ( \Delta {V}_{\text {FB}} ) of 0.4 V and interface fix charge ( {Q} _{\text {f}} ) of {3.98} \times {10}^{{13}} cm ^{-2} . X-ray photoelectron spectroscopy spectra of as-deposited and annealed Ta 2 O 5 film were analyzed for Ta and O compositions in the film. The sample annealed at 500 °C has shown Ta:O ratio of 0.41. X-ray diffraction analysis was done to check the crystallization of amorphous Ta 2 O 5 film at higher annealing temperatures. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2019.2893288 |