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Investigation of Ta2O5 as an Alternative High- Dielectric for InAlN/GaN MOS-HEMT on Si

We report on the demonstration and investigation of Ta 2 O 5 as high-k dielectric for InAlN/GaN-MOS high-electron mobility transistor (HEMT)-on-Si. Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition annea...

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Published in:IEEE transactions on electron devices 2019-03, Vol.66 (3), p.1230-1235
Main Authors: Kumar, Sandeep, Kumar, Himanshu, Vura, Sandeep, Pratiyush, Anamika Singh, Charan, Vanjari Sai, Dolmanan, Surani B., Tripathy, Sudhiranjan, Muralidharan, Rangarajan, Nath, Digbijoy N.
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container_title IEEE transactions on electron devices
container_volume 66
creator Kumar, Sandeep
Kumar, Himanshu
Vura, Sandeep
Pratiyush, Anamika Singh
Charan, Vanjari Sai
Dolmanan, Surani B.
Tripathy, Sudhiranjan
Muralidharan, Rangarajan
Nath, Digbijoy N.
description We report on the demonstration and investigation of Ta 2 O 5 as high-k dielectric for InAlN/GaN-MOS high-electron mobility transistor (HEMT)-on-Si. Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal (PDA) conditions. The gate leakage was 16 nA/mm at −15 V which was ~five orders of magnitude lower compared to reference HEMT. The 2-D electron gas (2-DEG) density was found to vary with annealing temperature suggesting the presence of net charge at the Ta 2 O 5 /InAlN interface. Dispersion in the capacitance-voltage ( {C} - {V} ) characteristics was used to estimate the frequency-dependent interface charge, while energy band diagrams under flat band conditions were investigated to estimate fixed charge. The optimum anneal condition was found to be 500 °C which has resulted into a flat band voltage spread ( \Delta {V}_{\text {FB}} ) of 0.4 V and interface fix charge ( {Q} _{\text {f}} ) of {3.98} \times {10}^{{13}} cm ^{-2} . X-ray photoelectron spectroscopy spectra of as-deposited and annealed Ta 2 O 5 film were analyzed for Ta and O compositions in the film. The sample annealed at 500 °C has shown Ta:O ratio of 0.41. X-ray diffraction analysis was done to check the crystallization of amorphous Ta 2 O 5 film at higher annealing temperatures.
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Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal (PDA) conditions. The gate leakage was 16 nA/mm at −15 V which was ~five orders of magnitude lower compared to reference HEMT. The 2-D electron gas (2-DEG) density was found to vary with annealing temperature suggesting the presence of net charge at the Ta 2 O 5 /InAlN interface. Dispersion in the capacitance-voltage (<inline-formula> <tex-math notation="LaTeX">{C} </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">{V} </tex-math></inline-formula>) characteristics was used to estimate the frequency-dependent interface charge, while energy band diagrams under flat band conditions were investigated to estimate fixed charge. The optimum anneal condition was found to be 500 °C which has resulted into a flat band voltage spread (<inline-formula> <tex-math notation="LaTeX">\Delta {V}_{\text {FB}} </tex-math></inline-formula>) of 0.4 V and interface fix charge (<inline-formula> <tex-math notation="LaTeX">{Q} _{\text {f}} </tex-math></inline-formula>) of <inline-formula> <tex-math notation="LaTeX">{3.98} \times {10}^{{13}} </tex-math></inline-formula> cm<inline-formula> <tex-math notation="LaTeX">^{-2} </tex-math></inline-formula>. X-ray photoelectron spectroscopy spectra of as-deposited and annealed Ta 2 O 5 film were analyzed for Ta and O compositions in the film. The sample annealed at 500 °C has shown Ta:O ratio of 0.41. X-ray diffraction analysis was done to check the crystallization of amorphous Ta 2 O 5 film at higher annealing temperatures.]]></description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2019.2893288</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>2-D electron gas (2-DEG) ; Annealing ; capacitance–voltage (&lt;italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"&gt;C –&lt;italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"&gt;V ) ; Crystallization ; Current leakage ; Dielectrics ; Electric potential ; Electron gas ; Electron mobility ; Gates ; Handheld computers ; HEMTs ; high-&lt;italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"&gt;k ; high-electron mobility transistor (HEMT) ; High-k dielectric materials ; Investigations ; Logic gates ; Photoelectrons ; Spectrum analysis ; Tantalum ; Tantalum oxides ; Ta₂O ; X-ray diffraction</subject><ispartof>IEEE transactions on electron devices, 2019-03, Vol.66 (3), p.1230-1235</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal (PDA) conditions. The gate leakage was 16 nA/mm at −15 V which was ~five orders of magnitude lower compared to reference HEMT. The 2-D electron gas (2-DEG) density was found to vary with annealing temperature suggesting the presence of net charge at the Ta 2 O 5 /InAlN interface. Dispersion in the capacitance-voltage (<inline-formula> <tex-math notation="LaTeX">{C} </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">{V} </tex-math></inline-formula>) characteristics was used to estimate the frequency-dependent interface charge, while energy band diagrams under flat band conditions were investigated to estimate fixed charge. 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Ta 2 O 5 of thickness 24 nm and dielectric constant ~30 was sputter deposited on InAlN/GaN HEMT and was investigated for different post deposition anneal (PDA) conditions. The gate leakage was 16 nA/mm at −15 V which was ~five orders of magnitude lower compared to reference HEMT. The 2-D electron gas (2-DEG) density was found to vary with annealing temperature suggesting the presence of net charge at the Ta 2 O 5 /InAlN interface. Dispersion in the capacitance-voltage (<inline-formula> <tex-math notation="LaTeX">{C} </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">{V} </tex-math></inline-formula>) characteristics was used to estimate the frequency-dependent interface charge, while energy band diagrams under flat band conditions were investigated to estimate fixed charge. The optimum anneal condition was found to be 500 °C which has resulted into a flat band voltage spread (<inline-formula> <tex-math notation="LaTeX">\Delta {V}_{\text {FB}} </tex-math></inline-formula>) of 0.4 V and interface fix charge (<inline-formula> <tex-math notation="LaTeX">{Q} _{\text {f}} </tex-math></inline-formula>) of <inline-formula> <tex-math notation="LaTeX">{3.98} \times {10}^{{13}} </tex-math></inline-formula> cm<inline-formula> <tex-math notation="LaTeX">^{-2} </tex-math></inline-formula>. X-ray photoelectron spectroscopy spectra of as-deposited and annealed Ta 2 O 5 film were analyzed for Ta and O compositions in the film. The sample annealed at 500 °C has shown Ta:O ratio of 0.41. X-ray diffraction analysis was done to check the crystallization of amorphous Ta 2 O 5 film at higher annealing temperatures.]]></abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TED.2019.2893288</doi><tpages>6</tpages><orcidid>https://orcid.org/0000-0003-2606-9711</orcidid><orcidid>https://orcid.org/0000-0001-7253-646X</orcidid><orcidid>https://orcid.org/0000-0001-5060-4839</orcidid><orcidid>https://orcid.org/0000-0003-4448-4943</orcidid></addata></record>
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subjects 2-D electron gas (2-DEG)
Annealing
capacitance–voltage (<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">C –<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">V )
Crystallization
Current leakage
Dielectrics
Electric potential
Electron gas
Electron mobility
Gates
Handheld computers
HEMTs
high-<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">k
high-electron mobility transistor (HEMT)
High-k dielectric materials
Investigations
Logic gates
Photoelectrons
Spectrum analysis
Tantalum
Tantalum oxides
Ta₂O
X-ray diffraction
title Investigation of Ta2O5 as an Alternative High- Dielectric for InAlN/GaN MOS-HEMT on Si
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