Wafer-level packaging technology for MEMS

This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding...

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Bibliographic Details
Main Author: Mirza, A.R.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Costs
Microelectromechanical devices
Microelectromechanical systems
Micromechanical devices
Packaging
Production
Silicon
Wafer bonding
Wafer scale integration
Online Access:Request full text
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Description
Summary:This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described.
ISSN:1089-9870
DOI:10.1109/ITHERM.2000.866816