Stress Simulation Analysis of Electronic Devices on Cloud Platform

The existing reliability prediction methods based on physics of failure models calculate time to failure of electronic devices under multiple mission profiles. These methods need calculate multiple simulation test samples' reliability parameters by multi-stress simulations. Therefore, it's...

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Bibliographic Details
Main Authors: Fang, Jiayue, Chen, Yin, Kang, Rui
Format: Conference Proceeding
Language:English
Subjects:
Analytical models
cloud computing
Computational modeling
Finite element analysis
Load modeling
physics of failure
simulation analysis
Solid modeling
Three-dimensional displays
Vibrations
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Summary:The existing reliability prediction methods based on physics of failure models calculate time to failure of electronic devices under multiple mission profiles. These methods need calculate multiple simulation test samples' reliability parameters by multi-stress simulations. Therefore, it's necessary to transfer the traditional computing model to the cloud environment and consider how to automatically simulate the simulation software on the cloud platform. In this work, we change the manual simulations of the ANSYS workbench simulation software into automated one by using workbench's own function to import and mesh the 3D geometric model and then using java's function to apply fixed supports, loads and processing solutions. In the case study, a FEA digital prototype is presented to illustrate automated stress simulation analysis.
ISSN:2575-2642
DOI:10.1109/ICRMS.2018.00053