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Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime
As operating frequency of the chips keeps increasing, high capacitance density MIMCap is needed to mitigate voltage droop for faster current injection. With high capacitance density, it is challenging to retain low leakage and long reliability lifetime. In this work, we will present an integrated MI...
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Main Authors: | , , , , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
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Summary: | As operating frequency of the chips keeps increasing, high capacitance density MIMCap is needed to mitigate voltage droop for faster current injection. With high capacitance density, it is challenging to retain low leakage and long reliability lifetime. In this work, we will present an integrated MIMCap with BEOL process which has robust TDDB. In addition, while retaining same high capacitance density and low leakage, this work will present a method to fabricate MIMCap with controlled TDDB lifetime, providing flexibility with voltage applied to either electrode. |
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ISSN: | 1938-1891 |
DOI: | 10.1109/IRPS.2019.8720407 |