A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module

This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integration offers a System in Package (SiP) solution w...

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Bibliographic Details
Main Authors: Lin, Y.T., Kao, K.S., Tzeng, C.M., Lin, H.H., Han, W.K., Chang, J.Y., Chang, T.C.
Format: Conference Proceeding
Language:English
Subjects:
Electromagnetic compatibility
EMC
Gate drivers
heterogeneous integration
Inverters
IPM
MOSFET
Multichip modules
power density
SiP
Substrates
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Summary:This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integration offers a System in Package (SiP) solution without causing serious Electromagnetic Compatibility (EMC), signal integrity and thermal issues. In addition, we designed the three-phase half-bridge inverter system formed by this IPM to compare with the system consisting of the same circuit and same bare dies of MOSFETs (TO-package), Gate Driver and MCU (SO-package). The performance shows that the inverter system which adopted this intelligent power module is capable of reducing system energy consumption, enhancing system efficiency (2-4%), and successfully shrinking system volume(>33%) at the same time. Besides, this SiP IPM can improve system reliability, electromagnetic compatibility (EMC) performance and pass the international standard of CISPR 11. Keywords-SiP, heterogeneous integration, IPM, EMC, power density.
ISSN:1946-0201
DOI:10.1109/ISPSD.2019.8757581