Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

• Main Authors: Tsai, Mike, Chiu, Ryan, Huang, Dick, Kao, Feng, He, Eric, Chen, J. Y., Chen, Simon, Tsai, Jensen, Wang, Yu-Po
• Format: Conference Proceeding
• Language: English
• Subjects: 3D System in Package (3D SiP); 5G mmWave; 5G mobile communication; Double Side Molding; Electromagnetic compatibility; FEM Module; Finite element analysis; GaAs & GaN; Heterogeneous Integration; IoT; Radio frequency; Reliability; Substrates; Three-dimensional displays; Two dimensional displays
• ISSN: 2377-5726
• DOI: 10.1109/ECTC.2019.00111

Recently, based on next generation wireless connectivity system evolution, there are more and more components combined into smartphone of Radio Frequency (RF) and Front-End Module (FEM) for up-coming 5G application. Also, the Internet of Things (IoT) continue to grow up due to the electronics industry is moved maturely on the mobile computing market for now. Both of IoT and 5G connectivity devices are required small form factor and high thermal performance. A 3D System in Package (3D SiP) including different approach, such as the double side molding technology and antenna in package (AiP) which is a combination solutions for these requirements. In this paper, the 3D SiP package platform will use dual side Surface Mount Technology (SMT) technology and 3D structure of double side molding to shrink overall package size of 3D SiP module. The calculation of package size can be shrunk around 60% area, package size can be reduced from 8 x 8mm to 6 x 6mm. From warpage and thermal performance are proceed simulation and measurement. And experiment including the DOE (Design of Experiment) study for molding process with different high thermal epoxy molding compound (EMC) selection to verify warpage performance. By utilizing advanced package structure solutions such as high speed SMT placement, Cu substrate with thermal pad for high thermal, double side molding, a 3D double side SiP module can provide a unique opportunity to address cost, performance, and time-to-market. Considering the limitations of power consumption and form factor, smart phone front end module will become the major requirements for SiP platforms. The characterization analysis will utilize simulation methodology and measurement correction for warpage and thermal performance comparison. Also, will proceed the typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, un-bias HAST) results as a verification for 3D double side SiP structure. Finally, this paper will find out the suitable 3D SiP structure and feasibility data for future IoT and 5G devices application.