Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics

Fan-Out Packages (FOPs) technology is actively researched because it enables high Input / Output (I/O) pads density, thin package, and cost reduction. Epoxy Molding Compound (EMC) materials play a major role in implementing FOPs. EMC acts as a substrate and also protects the chips from the outside....

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Bibliographic Details
Main Authors: Shin, Sangmyung, Lee, Hanmin, Kim, JunMo, Lee, Tae-Ik, Kim, Taek-Soo, Kyung, Youjin, Jeong, Minsu, Lee, Kwangjoo, Paik, Kyung-Wook
Format: Conference Proceeding
Language:English
Subjects:
Conferences
Die shift
Electronic components
Epoxy Formulation
Epoxy Molding Films
Fan-Out Panel-Level Packages
Warpage
Online Access:Request full text
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Summary:Fan-Out Packages (FOPs) technology is actively researched because it enables high Input / Output (I/O) pads density, thin package, and cost reduction. Epoxy Molding Compound (EMC) materials play a major role in implementing FOPs. EMC acts as a substrate and also protects the chips from the outside. Recently Epoxy Molding Films (EMFs) have been introduced because EMFs are advantageous for large-area molding and can solve planarization problem. However, there are many problems before using at FOPs such as voids, delamination, warpage, and die shift. Voids and delamination occur when moldability is bad. Coefficient of Thermal Expansion (CTE) mismatch between the EMFs and the chips induces thermos-mechanical stress resulting in a warpage during the molding process. Furthermore, die shift from their original position can be also found by warpage, resin flow, and curing shrinkage. Therefore, EMFs materials properties and their effects on FOPs characteristics should be investigated. In this study, thermo-mechanical properties of EMFs were optimized by epoxy formulation to improve FOPs characteristics. Epoxy, silica contents, curing agent, and additives (coupling agent, carbon black) were investigated to produce low CTE and high Glass Transition Temperature (Tg) properties. Then, multiple 10 mm × 10 mm × 200 x03BC;m chips were molded with the size of 100 mm × 100 mm using 400 x03BC;m thick EMFs. The chip to chip distance could be reduced from 12 mm to 5.7 mm without voids and delamination. The warpage of EMFs were measured using 3 Dimensional - Digital Image Correlation (3D - DIC) method, and the effects of process conditions on the warpage of EMFs were also evaluated. And the die shift after molding was quantitatively measured assessed by optical microscopy. Finally, thermal cycle and 85 °C / 85 % RH tests were performed to evaluate the FOPs using optimized EMFs
ISSN:2377-5726
DOI:10.1109/ECTC.2019.00177