Thermal Characterization and Reliability Assessment of Chip Scale Packaged Light-Emitting Diodes with High Color Rendering Index

This paper reports thermal characterization and reliability assessment of CSP LEDs with high color rendering index (>95). The high CRI CSP LEDs obtained by optimization of current flow, ohmic contact, and phosphor concentration. The EOS level of CSP LED improved by modification of internal struct...

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Bibliographic Details
Main Authors: Lee, Ju Ho, Ma, Byongjin, Jeon, Soo-Kun, Baek, Seung Ho, Lee, Kwan-Hun
Format: Conference Proceeding
Language:English
Subjects:
Conferences
Earth Observing System
Integrated circuits
Light emitting diodes
Packaging
Phosphors
Reliability
Online Access:Request full text
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Summary:This paper reports thermal characterization and reliability assessment of CSP LEDs with high color rendering index (>95). The high CRI CSP LEDs obtained by optimization of current flow, ohmic contact, and phosphor concentration. The EOS level of CSP LED improved by modification of internal structure. The current spreading of CSP LED enhanced by increasing number of fingers along vertical direction, and as a result, junction temperature of CSP LED also decreased. Phosphor concentration for encapsulation of CSP LED optimized through two different operating test conditions. CSP LED with relatively low phosphor concentration shows better reliability and estimated lifetime of 5.7326×10 4 hours.
ISSN:2474-1523
DOI:10.1109/THERMINIC.2019.8923561