Low Stress Packaging of MEMS Sensors via 3D Additive Manufacturing Techniques

MEMS sensors are sensitive to stresses generated in silicon chips during packaging, which is related to chip warpage in the presence of stress. The conventional soft die-attaching method is implemented in the manner of whole-layer adhesive or four-point adhesive layout, which has a certain effect on...

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Bibliographic Details
Main Authors: Shang, Erwei, Xu, Wei, Yang, Jie, Tang, Bin, Liu, Yu
Format: Conference Proceeding
Language:English
Subjects:
additive manufacturing
cellular architectures
die attaching
low stress
MEMS sensor
Online Access:Request full text
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Summary:MEMS sensors are sensitive to stresses generated in silicon chips during packaging, which is related to chip warpage in the presence of stress. The conventional soft die-attaching method is implemented in the manner of whole-layer adhesive or four-point adhesive layout, which has a certain effect on stress isolation. In this paper, new three-dimensional cellular die-attaching structures fabricated by direct ink writing process were proposed and investigated. The simulation and measurement results demonstrated that these new die-attaching structures have better stress isolation effects than conventional one-layer adhesive layout, and their die bonding strengths are high enough for high g impact. In conclusion, these new cellular die-attaching structures enabled by 3D additive manufacturing techniques will have a wide application in future MEMS packaging.
ISSN:2168-9229
DOI:10.1109/SENSORS43011.2019.8956930