Immunity Enhancement of the Power Distribution Network in Integrated Circuits With Coplanar Meander Lines in Package

Integrated circuits suffer from interference in frequency multibands in real scenarios, and this susceptibility allows them to easily malfunction. In this article, a novel miniature coplanar filter in package to enhance the immunity of integrated circuits is proposed. The coplanar structure of the f...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2020-10, Vol.62 (5), p.2238-2246
Main Authors: Pu, Bo, Fan, Jun, Nah, Wansoo
Format: Article
Language:English
Subjects:
Band-stop filter
Bandstop filters
Circuit design
coplanar meander lines
Couplings
Design
Design methodology
Electric power distribution
Frequencies
Immunity
Immunity testing
Inductance
Integrated circuits
integrated circuits (ICs)
interposer
Multilayers
package
power distribution network (PDN)
Resonant frequency
Substrates
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Summary:Integrated circuits suffer from interference in frequency multibands in real scenarios, and this susceptibility allows them to easily malfunction. In this article, a novel miniature coplanar filter in package to enhance the immunity of integrated circuits is proposed. The coplanar structure of the filter can avoid cost issues of the multilayers and can also be implemented in the substrate or interposer of the package, and also in a flexible/foldable board, with normal board, fabrication process. Analysis of the filtering characteristics and design method of a miniature filter with the required stop bands are demonstrated in detail. The designed band-stop filter can deteriorate noises in the required frequency bands, thus enhancing the immunity of integrated circuits. The immunity enhancement is validated with standard direct power injection measurements for the designed chip with or without our designed filter in package. The proposed methodology could be useful as a design guide to improve the immunity of integrated circuits without costly on-chip area and process.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2019.2962096