A Study of Bonding Pad Corrosion Caused by Contamination

This paper introduces a typical corrosion phenomenon of the Integrated Circuits. A three-terminal adjustable shunt regulator outputted abnormal voltage on a PCBA because its Vref pin was open. Bonding pad corrosion was confirmed by SEM&EDX analysis. The pad was electrical open to the surrounding...

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Bibliographic Details
Main Authors: Gan, Hao, Shi, Lin, Zhang, Xiuqun, Dai, Hongsheng
Format: Conference Proceeding
Language:English
Subjects:
Contamination
Corrosion
Delam
Open
Regulator
Silicone Oil
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Summary:This paper introduces a typical corrosion phenomenon of the Integrated Circuits. A three-terminal adjustable shunt regulator outputted abnormal voltage on a PCBA because its Vref pin was open. Bonding pad corrosion was confirmed by SEM&EDX analysis. The pad was electrical open to the surrounding schematic. After a whole investigation, several lots of wafers were confirmed to be contaminated by silicone oil which was introduced during the demolding process. Delamination occurred between the molding compound and die. Plating solution which contained chlorine and sulphur percolated into package during Tin Plating.Supplier of the regulator was recommended to improve the demolding process. Besides, routine reliability monitoring(such as C-SAM, HAST) can be executed in quality control process to eliminate this failure mode in customer's application.
ISSN:1946-1550
DOI:10.1109/IPFA47161.2019.8984817