Lead-free flip chip processing with halogen-free high density microvia substrates

Over the past few years, flip chip technology has been heavily focused on developing and refining the next generation of flip chip assembly and reliability technology; however, little attention has been paid to the environmentally conscious aspects of manufacturing and high process throughput. With...

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Bibliographic Details
Main Authors: Baynham, G., Baldwin, D.F., Boustedt, K., Kandelid, S., Mattsson, F., Wennerholm, C., Johansson, A., Patterson, D., Elenius, P., Balkan, H.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Environmentally friendly manufacturing techniques
Europe
Flip chip
Lead
Legislation
Manufacturing processes
Refining
Safety
Throughput
Online Access:Request full text
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Summary:Over the past few years, flip chip technology has been heavily focused on developing and refining the next generation of flip chip assembly and reliability technology; however, little attention has been paid to the environmentally conscious aspects of manufacturing and high process throughput. With legislation pending on the use of lead in Europe and Japan and to limit environmental impact, flip chip technology must address new ways to meet safety and environmental requirements for the materials and processes used during assembly. The focus of this work is to implement advanced lead-free solder interconnect technology with halogen-free high density microvia substrates and define a systems level low-cost flip chip material and process technology which minimizes environmental impact. The ultimate objective is to ensure that environmentally friendly materials are selected, along with acceptable process technology for all materials as well as for the flip chip assembly.
ISSN:1089-8190
2576-9626
DOI:10.1109/IEMT.2000.910736