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At-Speed Defect Localization by Combining Laser Scanning Microscopy and Power Spectrum Analysis
The defect detection capabilities of Power Spectrum Analysis (PSA) [1] have been successfully combined with local laser heating to isolate defective circuitry in a high-speed Si Phase Locked Loop (PLL). The defective operation resulted in missed counts when operating at multi-GHz speeds and elevated...
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| creator | Miller, Mary A. Cole, Edward I. Kraus, Garth M. Robertson, Perry J. |
| description | The defect detection capabilities of Power Spectrum Analysis (PSA) [1] have been successfully combined with local laser heating to isolate defective circuitry in a high-speed Si Phase Locked Loop (PLL). The defective operation resulted in missed counts when operating at multi-GHz speeds and elevated temperatures. By monitoring PSA signals at a specific frequency through zero-spanning and scanning the suspect device with a heating laser (1340 nm wavelength), the area(s) causing failure were localized. PSA circumvents the need for a rapid pass/fail detector like that used for Soft Defect Localization (SDL) [2] or Laser-Assisted Defect Analysis (LADA) [3] and converts the at-speed failure to a DC signature. The experimental setup for image acquisition and examples demonstrating utility are described. |
| doi_str_mv | 10.1109/IRPS45951.2020.9129560 |
| format | conference_proceeding |
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The defective operation resulted in missed counts when operating at multi-GHz speeds and elevated temperatures. By monitoring PSA signals at a specific frequency through zero-spanning and scanning the suspect device with a heating laser (1340 nm wavelength), the area(s) causing failure were localized. PSA circumvents the need for a rapid pass/fail detector like that used for Soft Defect Localization (SDL) [2] or Laser-Assisted Defect Analysis (LADA) [3] and converts the at-speed failure to a DC signature. The experimental setup for image acquisition and examples demonstrating utility are described.</description><identifier>EISSN: 1938-1891</identifier><identifier>EISBN: 9781728131993</identifier><identifier>EISBN: 1728131995</identifier><identifier>DOI: 10.1109/IRPS45951.2020.9129560</identifier><language>eng</language><publisher>IEEE</publisher><subject>functional failure ; LADA ; Location awareness ; missing count ; Phase locked loops ; Power lasers ; PSA ; Reliability ; SDL ; Si PLL ; Silicon ; Temperature measurement ; Temperature sensors</subject><ispartof>2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9129560$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,27924,54554,54931</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/9129560$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Miller, Mary A.</creatorcontrib><creatorcontrib>Cole, Edward I.</creatorcontrib><creatorcontrib>Kraus, Garth M.</creatorcontrib><creatorcontrib>Robertson, Perry J.</creatorcontrib><title>At-Speed Defect Localization by Combining Laser Scanning Microscopy and Power Spectrum Analysis</title><title>2020 IEEE International Reliability Physics Symposium (IRPS)</title><addtitle>IRPS</addtitle><description>The defect detection capabilities of Power Spectrum Analysis (PSA) [1] have been successfully combined with local laser heating to isolate defective circuitry in a high-speed Si Phase Locked Loop (PLL). The defective operation resulted in missed counts when operating at multi-GHz speeds and elevated temperatures. By monitoring PSA signals at a specific frequency through zero-spanning and scanning the suspect device with a heating laser (1340 nm wavelength), the area(s) causing failure were localized. PSA circumvents the need for a rapid pass/fail detector like that used for Soft Defect Localization (SDL) [2] or Laser-Assisted Defect Analysis (LADA) [3] and converts the at-speed failure to a DC signature. The experimental setup for image acquisition and examples demonstrating utility are described.</description><subject>functional failure</subject><subject>LADA</subject><subject>Location awareness</subject><subject>missing count</subject><subject>Phase locked loops</subject><subject>Power lasers</subject><subject>PSA</subject><subject>Reliability</subject><subject>SDL</subject><subject>Si PLL</subject><subject>Silicon</subject><subject>Temperature measurement</subject><subject>Temperature sensors</subject><issn>1938-1891</issn><isbn>9781728131993</isbn><isbn>1728131995</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2020</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotkM1KxDAUhaMgOI7zBILkBTrmJk3Tuyz1b6DiYHVd0jSVSJuWpiL16R11VofD-fgWh5BrYFsAhje7l30ZS5Sw5YyzLQJHmbATskGVguIpCEAUp2QFKNIIUoRzchHCBzvQIk1WpMrmqBytbeitba2ZaTEY3blvPbvB03qh-dDXzjv_Tgsd7ERLo_1ffXJmGoIZxoVq39D98PW7jgfH9NnTzOtuCS5ckrNWd8Fujrkmb_d3r_ljVDw_7PKsiByXMEcabYy2aVnNEwW1ZC3EUippVGxbFMiUTHlrlGQ1CCl40yRag1BGxAx0IsSaXP17nbW2GifX62mpjn-IH-rxVPE</recordid><startdate>20200401</startdate><enddate>20200401</enddate><creator>Miller, Mary A.</creator><creator>Cole, Edward I.</creator><creator>Kraus, Garth M.</creator><creator>Robertson, Perry J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>20200401</creationdate><title>At-Speed Defect Localization by Combining Laser Scanning Microscopy and Power Spectrum Analysis</title><author>Miller, Mary A. ; Cole, Edward I. ; Kraus, Garth M. ; Robertson, Perry J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i251t-a9e49edf0b2671b50f145575c74ef93907582fc750b13532dd6aa137c3401a633</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2020</creationdate><topic>functional failure</topic><topic>LADA</topic><topic>Location awareness</topic><topic>missing count</topic><topic>Phase locked loops</topic><topic>Power lasers</topic><topic>PSA</topic><topic>Reliability</topic><topic>SDL</topic><topic>Si PLL</topic><topic>Silicon</topic><topic>Temperature measurement</topic><topic>Temperature sensors</topic><toplevel>online_resources</toplevel><creatorcontrib>Miller, Mary A.</creatorcontrib><creatorcontrib>Cole, Edward I.</creatorcontrib><creatorcontrib>Kraus, Garth M.</creatorcontrib><creatorcontrib>Robertson, Perry J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Miller, Mary A.</au><au>Cole, Edward I.</au><au>Kraus, Garth M.</au><au>Robertson, Perry J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>At-Speed Defect Localization by Combining Laser Scanning Microscopy and Power Spectrum Analysis</atitle><btitle>2020 IEEE International Reliability Physics Symposium (IRPS)</btitle><stitle>IRPS</stitle><date>2020-04-01</date><risdate>2020</risdate><spage>1</spage><epage>5</epage><pages>1-5</pages><eissn>1938-1891</eissn><eisbn>9781728131993</eisbn><eisbn>1728131995</eisbn><abstract>The defect detection capabilities of Power Spectrum Analysis (PSA) [1] have been successfully combined with local laser heating to isolate defective circuitry in a high-speed Si Phase Locked Loop (PLL). The defective operation resulted in missed counts when operating at multi-GHz speeds and elevated temperatures. By monitoring PSA signals at a specific frequency through zero-spanning and scanning the suspect device with a heating laser (1340 nm wavelength), the area(s) causing failure were localized. PSA circumvents the need for a rapid pass/fail detector like that used for Soft Defect Localization (SDL) [2] or Laser-Assisted Defect Analysis (LADA) [3] and converts the at-speed failure to a DC signature. The experimental setup for image acquisition and examples demonstrating utility are described.</abstract><pub>IEEE</pub><doi>10.1109/IRPS45951.2020.9129560</doi><tpages>5</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | EISSN: 1938-1891 |
| ispartof | 2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5 |
| issn | 1938-1891 |
| language | eng |
| recordid | cdi_ieee_primary_9129560 |
| source | IEEE Xplore All Conference Series |
| subjects | functional failure LADA Location awareness missing count Phase locked loops Power lasers PSA Reliability SDL Si PLL Silicon Temperature measurement Temperature sensors |
| title | At-Speed Defect Localization by Combining Laser Scanning Microscopy and Power Spectrum Analysis |
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