Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package

Fan-Out WLP with 2-layer molded structure have been proposed for high performance Antenna-in-Package (AiP) for 5G mmWave applications with improved thermal dissipation capability. MMIC chip is embedded in lower mold compound layer with chip facing up to enable the backside of chip to be designed wit...

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Bibliographic Details
Main Authors: Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong
Format: Conference Proceeding
Language:English
Subjects:
2-layer molding
Antenna-in-Package
Antennas
Conferences
Electronic components
Fabrication
FO-WLP
reliability
Semiconductor device reliability
thermal solution
wafer fabrication
Online Access:Request full text
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Description
Summary:Fan-Out WLP with 2-layer molded structure have been proposed for high performance Antenna-in-Package (AiP) for 5G mmWave applications with improved thermal dissipation capability. MMIC chip is embedded in lower mold compound layer with chip facing up to enable the backside of chip to be designed with direct connection to thermal solution to PCB. The feedlines are implemented in-between top and bottom Epoxy Molding Compound (EMC) layers and there can be enhanced with ground layer for minimizing interference from antenna to RF feedline and MMIC. The electrical, mechanical and thermal design considerations, process integration and package reliability are described.
ISSN:2377-5726
DOI:10.1109/ECTC32862.2020.00016