Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Current roadblocks within the collective die-to-wafer bonding flow, limiting die-transfer yield and throughput, are identified and discussed. Based on the obtained assessment a new carrier system is introduced. The use of the ultra-soft and highly-UV-transparent BrewerBOND ® C1301 material and its c...

Full description

Saved in:
Bibliographic Details
Main Authors: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bauder, Olga, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Liu, Xiao, Schmidt, Thomas, Beyer, Gerald, Beyne, Eric
Format: Conference Proceeding
Language:English
Subjects:
Annealing
Bonding
Chemical lasers
Coatings
Die-to-wafer bonding
dielectric bonding
Force
Glass
Heterogeneous Integration
Hybrid bonding
Laser debonding
Temporary bonding material
Wafer bonder
Citations: Items that cite this one
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Current roadblocks within the collective die-to-wafer bonding flow, limiting die-transfer yield and throughput, are identified and discussed. Based on the obtained assessment a new carrier system is introduced. The use of the ultra-soft and highly-UV-transparent BrewerBOND ® C1301 material and its compatibility with BrewerBOND ® 701 laser release material, which is coated on top of ultra-thin dies, allows for a room temperature, ultra-low force collective bonding with laser-assisted die transfer sequence.
ISSN:2377-5726
DOI:10.1109/ECTC32862.2020.00056