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Electrical breakdown spots in metal-aluminum oxide-metal structures
Metal-aluminum oxide-metal structures are prepared by evaporation in vacuum on silicon wafers using Au, Cu or Pd on top and Al as bottom electrode. The aluminum oxide layer is deposited by electron beam evaporation with a thickness of 200 nm. The diameter of the top electrode is varied between 0.1 a...
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Published in: | IEEE transactions on dielectrics and electrical insulation 2020-08, Vol.27 (4), p.1080-1085 |
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description | Metal-aluminum oxide-metal structures are prepared by evaporation in vacuum on silicon wafers using Au, Cu or Pd on top and Al as bottom electrode. The aluminum oxide layer is deposited by electron beam evaporation with a thickness of 200 nm. The diameter of the top electrode is varied between 0.1 and 1.9 mm. Capacitance measurements reveal a relaxational dielectric permittivity as expected for aluminum oxide. Applying ramp voltages results in single breakdown spots on the electrode before the structure finally becomes conductive. The breakdown spots, as characterized with an AFM, are in the form a crater, reaching 500 nm into the silicon. However, for the smallest electrode, the calculated electrostatic energy stored in the capacitance is not high enough to form the craters. |
doi_str_mv | 10.1109/TDEI.2020.008526 |
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The aluminum oxide layer is deposited by electron beam evaporation with a thickness of 200 nm. The diameter of the top electrode is varied between 0.1 and 1.9 mm. Capacitance measurements reveal a relaxational dielectric permittivity as expected for aluminum oxide. Applying ramp voltages results in single breakdown spots on the electrode before the structure finally becomes conductive. The breakdown spots, as characterized with an AFM, are in the form a crater, reaching 500 nm into the silicon. However, for the smallest electrode, the calculated electrostatic energy stored in the capacitance is not high enough to form the craters.</description><identifier>ISSN: 1070-9878</identifier><identifier>EISSN: 1558-4135</identifier><identifier>DOI: 10.1109/TDEI.2020.008526</identifier><identifier>CODEN: ITDIES</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>AFM ; Aluminum ; Aluminum oxide ; breakdown spots ; Capacitance ; cold fusion ; Copper ; Diameters ; Dielectric relaxation ; Electric breakdown ; Electrical faults ; Electrodes ; Electron beams ; Evaporation ; Gold ; hydrogen ; metal-aluminum oxide-metal structures ; Palladium ; partial electrical breakdown ; Silicon ; Silicon wafers ; Voltage measurement</subject><ispartof>IEEE transactions on dielectrics and electrical insulation, 2020-08, Vol.27 (4), p.1080-1085</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c291t-834b3df7fce1b213386ecf69e547ffaf09b0439d4ffc99bc147f5f5d682b84d93</citedby><cites>FETCH-LOGICAL-c291t-834b3df7fce1b213386ecf69e547ffaf09b0439d4ffc99bc147f5f5d682b84d93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9160402$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,27903,27904,54774</link.rule.ids></links><search><creatorcontrib>Kliem, Herbert</creatorcontrib><creatorcontrib>Faliya, Kapil</creatorcontrib><title>Electrical breakdown spots in metal-aluminum oxide-metal structures</title><title>IEEE transactions on dielectrics and electrical insulation</title><addtitle>T-DEI</addtitle><description>Metal-aluminum oxide-metal structures are prepared by evaporation in vacuum on silicon wafers using Au, Cu or Pd on top and Al as bottom electrode. The aluminum oxide layer is deposited by electron beam evaporation with a thickness of 200 nm. The diameter of the top electrode is varied between 0.1 and 1.9 mm. Capacitance measurements reveal a relaxational dielectric permittivity as expected for aluminum oxide. Applying ramp voltages results in single breakdown spots on the electrode before the structure finally becomes conductive. The breakdown spots, as characterized with an AFM, are in the form a crater, reaching 500 nm into the silicon. However, for the smallest electrode, the calculated electrostatic energy stored in the capacitance is not high enough to form the craters.</description><subject>AFM</subject><subject>Aluminum</subject><subject>Aluminum oxide</subject><subject>breakdown spots</subject><subject>Capacitance</subject><subject>cold fusion</subject><subject>Copper</subject><subject>Diameters</subject><subject>Dielectric relaxation</subject><subject>Electric breakdown</subject><subject>Electrical faults</subject><subject>Electrodes</subject><subject>Electron beams</subject><subject>Evaporation</subject><subject>Gold</subject><subject>hydrogen</subject><subject>metal-aluminum oxide-metal structures</subject><subject>Palladium</subject><subject>partial electrical breakdown</subject><subject>Silicon</subject><subject>Silicon wafers</subject><subject>Voltage measurement</subject><issn>1070-9878</issn><issn>1558-4135</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNo9kEtLAzEURoMoWB97wc2A69Sb5yRLqVULBTd1HTKZBKbOoyYZ1H_v1BFX9_JxvnvhIHRDYEkI6Pvd43qzpEBhCaAElSdoQYRQmBMmTqcdSsBaleocXaS0ByB8ghZotW69y7Fxti2q6O17PXz2RToMORVNX3Q-2xbbduyafuyK4aupPf4Ni5Tj6PIYfbpCZ8G2yV__zUv09rTerV7w9vV5s3rYYkc1yVgxXrE6lMF5UlHCmJLeBam94GUINoCugDNd8xCc1pUjUyyCqKWileK1Zpfobr57iMPH6FM2-2GM_fTSUM5ISaRScqJgplwcUoo-mENsOhu_DQFzVGWOqsxRlZlVTZXbudJ47_9xTSRwoOwHXSBlkg</recordid><startdate>202008</startdate><enddate>202008</enddate><creator>Kliem, Herbert</creator><creator>Faliya, Kapil</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>202008</creationdate><title>Electrical breakdown spots in metal-aluminum oxide-metal structures</title><author>Kliem, Herbert ; Faliya, Kapil</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c291t-834b3df7fce1b213386ecf69e547ffaf09b0439d4ffc99bc147f5f5d682b84d93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>AFM</topic><topic>Aluminum</topic><topic>Aluminum oxide</topic><topic>breakdown spots</topic><topic>Capacitance</topic><topic>cold fusion</topic><topic>Copper</topic><topic>Diameters</topic><topic>Dielectric relaxation</topic><topic>Electric breakdown</topic><topic>Electrical faults</topic><topic>Electrodes</topic><topic>Electron beams</topic><topic>Evaporation</topic><topic>Gold</topic><topic>hydrogen</topic><topic>metal-aluminum oxide-metal structures</topic><topic>Palladium</topic><topic>partial electrical breakdown</topic><topic>Silicon</topic><topic>Silicon wafers</topic><topic>Voltage measurement</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kliem, Herbert</creatorcontrib><creatorcontrib>Faliya, Kapil</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE/IET Electronic Library</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on dielectrics and electrical insulation</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kliem, Herbert</au><au>Faliya, Kapil</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electrical breakdown spots in metal-aluminum oxide-metal structures</atitle><jtitle>IEEE transactions on dielectrics and electrical insulation</jtitle><stitle>T-DEI</stitle><date>2020-08</date><risdate>2020</risdate><volume>27</volume><issue>4</issue><spage>1080</spage><epage>1085</epage><pages>1080-1085</pages><issn>1070-9878</issn><eissn>1558-4135</eissn><coden>ITDIES</coden><abstract>Metal-aluminum oxide-metal structures are prepared by evaporation in vacuum on silicon wafers using Au, Cu or Pd on top and Al as bottom electrode. The aluminum oxide layer is deposited by electron beam evaporation with a thickness of 200 nm. The diameter of the top electrode is varied between 0.1 and 1.9 mm. Capacitance measurements reveal a relaxational dielectric permittivity as expected for aluminum oxide. Applying ramp voltages results in single breakdown spots on the electrode before the structure finally becomes conductive. The breakdown spots, as characterized with an AFM, are in the form a crater, reaching 500 nm into the silicon. However, for the smallest electrode, the calculated electrostatic energy stored in the capacitance is not high enough to form the craters.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TDEI.2020.008526</doi><tpages>6</tpages></addata></record> |
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subjects | AFM Aluminum Aluminum oxide breakdown spots Capacitance cold fusion Copper Diameters Dielectric relaxation Electric breakdown Electrical faults Electrodes Electron beams Evaporation Gold hydrogen metal-aluminum oxide-metal structures Palladium partial electrical breakdown Silicon Silicon wafers Voltage measurement |
title | Electrical breakdown spots in metal-aluminum oxide-metal structures |
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