High thermally conductive underfill for flip-chip applications

High thermal conductivity underfill has been developed. The underfill is filled with fine particle size aluminum nitride that provides the high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for underfill, such as the Level 3 JEDEC preconditioning test. T...

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Bibliographic Details
Main Authors: Suzuki, K., Suzuki, O., Muramatu, K., Yuda, T., Isobe, K., Maruyama, H., Fukuyama, H.
Format: Conference Proceeding
Language:English
Subjects:
Aluminum nitride
Conducting materials
Electrical resistance measurement
Materials science and technology
Packaging
Silicon compounds
Thermal conductivity
Thermal factors
Thermal management
Thermal resistance
Online Access:Request full text
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Summary:High thermal conductivity underfill has been developed. The underfill is filled with fine particle size aluminum nitride that provides the high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for underfill, such as the Level 3 JEDEC preconditioning test. This paper presents work in developing an approach to underfill material for flip-chip packaging using aluminum nitride.
DOI:10.1109/ISAOM.2001.916547