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A Study of On-state Breakdown Decreasing of nLDMOSFETs by Hole Current Increase Depending on Drain Pulse Rise Time
The introduction of a p-type RESURF (REduced SURface Field) layer under an n-type drift region is a well-known means to improve the specific on-resistance (R_{\mathbf{sp}}) versus the off-state breakdown voltage (BV_{\mathbf{off}}) trade-off and reduce hot carrier injection (HCI) degradation in n-ch...
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Main Authors: | , , , , , , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
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Summary: | The introduction of a p-type RESURF (REduced SURface Field) layer under an n-type drift region is a well-known means to improve the specific on-resistance (R_{\mathbf{sp}}) versus the off-state breakdown voltage (BV_{\mathbf{off}}) trade-off and reduce hot carrier injection (HCI) degradation in n-channel LDMOSFETs (nLDMOSFETs). The p-type RESURF layer also works as a punch-through stopper to maintain sufficient source/drain (S/D) negative bias capability to sub. However, the short rise time (T_{\mathbf{r}}) of the pulse input to drain has the disadvantage of decreasing the on-state breakdown voltage (BV_{\mathbf{on}}) with a large channel width layout. A mechanism for the decrease in the BV_{\mathbf{on}} for an nLDMOSFET with a p-type RESURF layer is clarified, and a method to suppress the decrease in BV_{\mathbf{on}} is proposed. |
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ISSN: | 1946-0201 |
DOI: | 10.1109/ISPSD46842.2020.9170123 |